Camera module, method of assembly and imaging device

摘要

A camera module has a lens module mounted on a substrate. The image sensor is located in a cavity in the substrate and is connected to the substrate by a bridge member, the infra-red filter. The image sensor is attached to the infra-red filter by a ring of adhesive surrounding the imaging area of the image sensor. The adhesive attaching the image sensor to the infra-red filter comprises spacers. The infra-red filter is attached to the substrate by adhesive. The cavity may extend through the substrate. The image sensor is further connected to the substrate by a sheet member, which may be made of metal. The sheet member is affixed to the bottom of the substrate and covers the hole in the substrate formed by the extension of the cavity through the substrate. A method of assembly of the camera module includes: providing a substrate with a cavity; locating the image sensor in the cavity; connecting the infra-red filter to the image sensor and the substrate; and mounting the lens module on the substrate.

主权项

1. A camera module, comprising:
a substrate having a cavity; a lens module mounted on the substrate, the lens module including a lens; an image sensor located in the cavity of the substrate and having opposing first and second image sensor ends and opposing third and fourth image sensor ends; conductive elements electrically coupling the image sensor to the substrate; a bridge member being integral and located between the lens and the image sensor and having opposing first and second bridge ends and opposing third and fourth bridge ends, the bridge being oriented with respect to the image sensor such that the first and second bridge ends extend beyond the third and fourth image sensor ends and at least a portion of the third and fourth bridge ends terminate over the image sensor, exposing the conductive elements; and adhesive that couples the image sensor to the bridge member, the adhesive being distinct from the conductive elements.