| 摘要 |
PROBLEM TO BE SOLVED: To allow a sensor wafer to be configured for in-situ measurement of parameters during an etch process.SOLUTION: A sensor wafer includes a substrate, a cover, and one or more components positioned between the substrate and the cover. Etch-resistant coating is formed on one or more surfaces of the cover and/or the substrate. The coating is configured to resist etch processes that etch the cover and/or the substrate for a longer period compared with standard thin film materials of the same or greater thickness than the protective (etch-resistant) coating.SELECTED DRAWING: Figure 3 |
