| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing device and a polishing method for making uniform distribution of pressure in the process of polishing on the surface to be polished of an object to be polished so that the whole surface of the surface to be polished can be uniformly polished. <P>SOLUTION: A holding head 50 used in the polishing device includes: a container; a film 8 sealing the container, sucking the object S, and to be expanded by dry air from a compressor 80; a pressing plate 110 disposed in the container inside the film 8; a position adjusting means 15 expanded by dry air from the compressor 80 to press the pressing plate 110; and an elastic film 12 provided on the polished object side of the pressing plate 110. The surface of the pressing plate 110 having the elastic film 12 is provided with annular pressing projections 111, 112 for making uniform the distribution of pressure on the surface Sa to be polished of the object S. In addition to application of pressure depending on the positive pressure P2 to the object S, the object S is pressed through the annular pressing projection 11 by the position adjusting means 15 to which positive pressure P1 larger than the positive pressure P2 is applied, thereby controlling the distribution of pressure on the surface Sa. <P>COPYRIGHT: (C)2004,JPO |
