Manufacturing apparatus of electronic component and manufacturing method thereof

摘要

A first alignment mark is given to a substrate, and a second alignment mark is given to a mask. The mask forms an electronic circuit pattern on the substrate. A control unit performs alignment of the mask and the substrate based on the first and second alignment marks. The second alignment mark is formed to surround the first alignment mark. The second alignment mark has a step pattern therein.

主权项

1. A manufacturing apparatus of an electronic component, the apparatus comprising:
a substrate that has a first alignment mark; a mask for printing an electronic circuit pattern on the substrate, the mask having a second alignment mark; and a controller that performs alignment of the mask and the substrate based on the first and second alignment marks, wherein the first alignment mark comprises a plating and has a cross shape, the second alignment mark includes four parts that surround the first alignment mark from four orientations and has a plurality of step patterns in two directions corresponding to the cross shape of the first alignment mark, each of the step patterns has first to third steps arranged in this order from a center towards an exterior of the second alignment mark so as to increase, in a direction from the center towards the exterior, a space between two parts of the second alignment mark facing each other, a length of the first and second steps is one unit length and a length of the third step is two unit lengths, a smallest distance between the first and second alignment marks is provided at a junction of adjacent legs of the cross shaped second alignment mark; and the controller adjusts a relative position of the mask and the substrate based on an amount of overlap between the step patterns of the second alignment mark and a linear portion of the cross shape of the first alignment mark.