发明名称 WOUND STRUCTURE OF ULTRAFINE GOLD BONDING WIRE AND METHOD FOR WINDING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wound structure of ultrafine gold bonding wires wherein springback at the lead wound section is suppressed even when the wire cutting method is used and collapse of the main wound section due to loosened ultrafine gold wires is suppressed even when the main wound section is a cross wound lamination of many layers, and to provide a method for winding the same. <P>SOLUTION: A close contact exists between two neighboring ultrafine gold wires 2 in a regularly wound lead section a, so that springback is prevented even when the wire cutting method is used without peeling off an end tape 3. A plurality of regularly wound ultrafine gold wires 2 of a tail wound section c are in contact with the upper layer of a tapered part b-1 of a tightly packed main wound section b, and the ultrafine gold wires 2 of the tapered part b-1 and the regularly wound ultrafine gold wires 2 of the tail wound section c are entangled with one another. As a result, the main wound section b is prevented from a collapse (disordered winding). <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004111449(A) 申请公布日期 2004.04.08
申请号 JP20020268416 申请日期 2002.09.13
申请人 TANAKA ELECTRONICS IND CO LTD 发明人 YANAGA YUKIHIRO;KUBOTA AKITOMO
分类号 H01L21/60 主分类号 H01L21/60
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