| 摘要 |
A multilayer printed wiring board is described having (1) an inner layer conductive pattern on an organic insulating base material, (2) a poly(vinyl acetal)-phenolic resin coating containing an amine substituted organic zirconate or titanate coupling agent, (3) a dielectric insulating layer, (4) a bonding composition capable of being adhesion promoted for electroless metal deposition comprising a phenolic resin having at least two methylol groups and substantially free of methyl ether groups, a heat resistant aromatic or cyclic resin having functional groups capable of reacting with the methylol groups without the evolution of water, and (5) an outer conductive pattern, the multilayer board being capable of withstanding at least five soldering cycles of at least 255.degree.C for 2 seconds without blistering or delamination. Processes for manufacturing the multilayer board are also described. |
