发明名称 Semiconductor wafer boat having stackable independently replaceable boat parts and vertical heat-treating apparatus comprising the same
摘要 A semiconductor wafer boat has a plurality of discrete boat parts stacked one atop the other. Each of the of the boat parts includes a wafer support in the form of a plurality of columns each having a plurality of vertically spaced apart grooves for use in supporting semiconductor wafers as vertically spaced from one another. Corresponding ones of the grooves in the columns of a boat part can receive the outer peripheral edge of the wafer directly, or a ring plate to which the wafer is mounted. Each adjacent pair of boat parts has confronting end portions forming a joint at which the boat parts of the pair are freely coupled to one another such that each of the boat parts may be replaced independently of the other boat parts. Thus, when any of the boat parts experiences thermal deformation after long periods of use, the boat part may be readily replaced without damaging any part of the boat and without the costs associated with replacing the boat entirely.
申请公布号 US6716027(B2) 申请公布日期 2004.04.06
申请号 US20010970690 申请日期 2001.10.05
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM HONG-GUEN;KIM BI-CHER
分类号 H01L21/683;C30B31/14;H01L21/205;H01L21/22;H01L21/673;(IPC1-7):F27D5/00 主分类号 H01L21/683
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