| 摘要 |
<p>PURPOSE:To prevent generation of short circuit failure resultant from a mutual contact between the tips of adjacent outer leads and a solder bridge to a printed board during mounting in terms of a surface mount type IC package. CONSTITUTION:As an outer lead, two types of outer leads, say, gall-wing-shaped outer lead 2 and a J lead-shaped outer lead are alternately laid out on a surface mount type IC package. This construction is effective to prevent the contact between the tip of each adjacent outer lead when the outer leads are subject to deformation produced by external force. In addition to that, this construction makes it possible to set a semiconductor mounting section in two stages even when they are mounted to a printed board, take up a longer distance in the adjacent solder-mounting section and provide an effect to prevent the generation of a solder bridge.</p> |
