| 摘要 |
<p>PURPOSE:To realize thinning/pitch narrowing (multipin) and cost reduction of this device. CONSTITUTION:A back facing 9 is made from one face of a circuit board 1 to expose a conductor pattern 4 on the bottom, and a semiconductor chip 7 is loaded. Further, the conductor wiring pattern 4 is connected to the semiconductor chip 7 with metal fine wires 8, and an encapsulating resin 3 is cast into the back facing 9, thereby protecting the semiconductor chip 7 and the metal fine wires 8 electrically and mechanically. An extension of the conductor pattern 4 is provided with outer electrodes 2.</p> |
