| 摘要 |
<p>PURPOSE:To reduce the deviation of a mask for exposure use in the case where the mask is aligned to one several by a method wherein an exposure, which is performed by a photolithography method, is repeated by a plural of times. CONSTITUTION:Via holes 2 for linking an internal wiring with a surface wiring are formed in a calcined ceramic multilayer board 1. Then, a conductor metal layer is formed on the whole surface of the board 1 and electrode 4 patterns and die pad 5 patterns are formed by a photolithography system. A mask pattern for photolithography use is a pattern to correspond to land 3 patterns and the electrode 4 and die pad 5 patterns. The shrinkage factor of the board 1 in after it is calcined is measured, the board is fed using a stepper at a feed rate calculated on the basis of this shrinkage factor and two times of exposures are performed on the board 1, whereby a surface conductor pattern of the board 1 is formed. As surface electrode conductors are formed using a single mask having such the pattern, unnecessary electrodes 6 are also formed simultaneously with the electrode conductors, but any problem is not generated at all.</p> |
