| 摘要 |
<p>PURPOSE:To materialize the saving of ceramic material, the prevention of the sag of a material for an electrode, and the common use of manufacture process by die-cutting specified shapes of ceramic wafers from a molded green sheet, and bonding a plurality of sintered ceramic wafers in a body, and then, forming an electrode on the wafer body. CONSTITUTION:Green sheets having specified thickness and width and consisting of ceramic are molded continuously. Next, the green sheets are die-cut into specified lengths so as to separate ceramic wafers 2 from the green sheets. Next, the ceramic wafers 2 are baked, and then the ceramic wafers 2 are bonded. Next, the ceramic body is polished, and then materials 3' and 4' for electrodes are printed on the top and bottom faces. Next, ceramic wafers 2 are juxtaposed on the earthed metallic plate 10, and the bottom electrode 4 of the wafers 2 are brought into contact with the metallic plate 10. On the other hand, a separate electrode 11 for polarization is put on the top electrodes 3 of the juxtaposed ceramic wafers 2. And, high voltage is applied between the metallic board 10 and the electrode 11.</p> |
