| 摘要 |
<p>PURPOSE:To provide a circuit substrate which excels in heat radiation characteristics and in packageability as packaging is possible with a high degree of adhesiveness to a curved surface of a heat radiator. CONSTITUTION:A plurality of insulating substrates 3 in which an electric circuit layer is formed are connected through a flexible resin layer 4 and it is so constructed that at least one end of each insulating substrate 3 is exposed to the surface of the resin layer 4. And the insulating substrate 3 comprises at least one kind of ceramic sinter selected from aluminium nitride, aluminium oxide, silicon carbide, beryllium oxide boron nitride, silicon nitride and magnesium oxide.</p> |
