| 摘要 |
<p>PURPOSE:To prevent a semiconductor device from tilting in the direction of a deviation angle theta of the applied position of an epoxy adhesive by the influence of the surface tension, etc., of the epoxy adhesive, at the time of mounting, and to prevent incorrect mounting. CONSTITUTION:The title die bonder has an X-Y-theta table 3 for holding a semiconductor device 2 arranged on a pressure sensitive adhesive sheet 1, an adhesive supplying part 6 for applying an epoxy adhesive on a lead frame island 4, a camera 8 and an image processor 9 for recognizing, from above, the lead frame island 4 and the epoxy adhesive applied on the lead frame island 4, and a mounting head 7 driven by a 4-axis drive mechanism of X-Y-Z-theta. And it measures the dislocation angle of an adhesive applied position against the lead frame island, and correcting the theta-axis of the mounting head after the picking up of a semiconductor device in accordance with this angle to perform mounting manipulation.</p> |
