<p>Solder tape automated bonding of leads to an integrated circuit chip is performed using a constant temperature, flat faced thermode and a clamping plate to keep the leads in contact with the integrated circuit chip.</p>
申请公布号
DE69114921(T2)
申请公布日期
1997.02.13
申请号
DE1991614921T
申请日期
1991.06.19
申请人
AT & T CORP., NEW YORK, N.Y., US
发明人
DAVISON, KERRY LEEDS, ALLENTOWN, PENNSYLVANIA 18103, US