发明名称 CARBONACEOUS-MATERIAL-CONTAINING RESIN COMPOSITION, ITS PRODUCTION AND CARBONACEOUSMATERIAL-CONTAINING RESIN MOLDING
摘要 PROBLEM TO BE SOLVED: To obtain a resin composition containing uniformly dispersed powder of a wood chip carbide and having improved moisture releasing and absorbing properties by mixing a resin with a wood chip carbide powder having a specified particle diameter and a surfactant in a specified ratio. SOLUTION: This composition is made by mixing 100 pts.wt. resin with 3-50 pts.wt. wood chip carbide powder having a particle diameter of 30μm or below and 0.5-10 pts.wt. surfactant. The resin used is a thermoplastic one such as a polyvinyl chloride resin, a polyethylene resin or a polystyrene resin or a thermoplastic one such as a urea resin or a phenolic resin, which are selected according to the object of use. The wood chip carbide is one obtained by carbonizing fine pieces of wood and powdering the obtained carbide, and starting trees for the wood chips are desirably coniferous trees, especially Japanese red pines. The smaller the particle diameter of the carbide is, the more the properties are bettered. The surfactant is selected according to the type of the resin used, namely an alkyl phosphate is used for a polystyrejte resin or the like, an alkyl sulfonate or the like is used for a polystyrene resin, and a glycerol monostearate is used for a thermosetting resin.
申请公布号 JPH1143611(A) 申请公布日期 1999.02.16
申请号 JP19970203656 申请日期 1997.07.29
申请人 HINOMARU KAABO TECHNO KK;SEIREN CO LTD;TAKAMATSU YUSHI KK;POLYMER KAKEN KK 发明人 KAWASHIRI YOSHITAKA;KONDO TOSHIHIRO;IGARASHI TAKESHI;SUGIHARA YOUTATSU
分类号 C08J5/18;C08J9/06;C08J9/12;C08K3/04;C08K5/00;C08K5/42;C08K5/521;C08L23/04;C08L23/10;C08L25/04;C08L27/06;C08L55/02;C08L75/04;C08L101/00;(IPC1-7):C08L101/00 主分类号 C08J5/18
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