发明名称 |
Convection cooled heat sink for electronic components |
摘要 |
The heat sink (1) consists of two comb shaped interlinked profiles (3,13). The profiles consist of metal plates with plane surfaces (2.12) on one side for mounting the components. On the other side are long webs (5,15) and short webs (6,16) between which are located corrugated fins (8) of aluminum. Gaps (9) between the profiles ensure that the fins are held securely.
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申请公布号 |
DE19806978(A1) |
申请公布日期 |
1999.08.26 |
申请号 |
DE1998106978 |
申请日期 |
1998.02.19 |
申请人 |
BEHR GMBH & CO |
发明人 |
DAMSOHN, HERBERT;PFENDER, CONRAD |
分类号 |
F28F3/02;F28F3/04;H01L23/367;H01L23/467;H05K7/20;(IPC1-7):H01L23/36 |
主分类号 |
F28F3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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