| 摘要 |
A chip package structure including a carrier, a chip, first bonding wires, second bonding wires, and an encapsulant is provided. The carrier has first contacts and at least one second contact, and the chip has at lease one first bonding pad and at least one second bonding pad. In addition, the first bonding wire electrically connects the first bonding pad and the first contact, and the second bonding wire electrically connects the second bonding pad and the second contact, wherein each of the first bonding pads electrically connects at least two first contacts through at least two first bonding wires, and each second bonding pad electrically connects the second contact through one single second bonding wire. Further, the encapsulant is disposed on the carrier to encapsulate the chip, the first bonding wires, and the second bonding wires.
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