METHODS FOR IDENTIFYING ARRAY AREAS IN DIES FORMED ON A WAFER AND METHODS FOR SETTING UP SUCH METHODS
摘要
<p>Methods for identifying array areas in dies formed on a wafer and methods for setting up such methods are provided. One method for identifying array areas in dies formed on a wafer includes comparing an array pattern in a template image acquired in one of the array areas to a search area image acquired for the wafer. The method also includes determining areas in the search area image in which a pattern is formed that substantially matches the array pattern in the template image based on results of the comparing step. In addition, the method includes identifying the array areas in the dies formed on the wafer based on results of the determining step.</p>
申请公布号
WO2008109820(A1)
申请公布日期
2008.09.12
申请号
WO2008US56212
申请日期
2008.03.07
申请人
KLA-TENCOR CORPORATION;CHEN, CHIEN-HUEI (ADAM);GUPTA, AJAY;WALLINGFORD, RICHARD;NAMJOSHI, KAUSTUBH;VAN RIET, MIKE;COOK, MICHAEL
发明人
CHEN, CHIEN-HUEI (ADAM);GUPTA, AJAY;WALLINGFORD, RICHARD;NAMJOSHI, KAUSTUBH;VAN RIET, MIKE;COOK, MICHAEL