| 摘要 |
PROBLEM TO BE SOLVED: To provide an ultrasonic horn, method of retaining a tool thereof, and a bump bonding apparatus using the same for ultrasonic bonding of ultra-fine portions through high-frequency ultrasonic vibration. SOLUTION: The end portions 30b of the ultrasonic horn can elastically hold a capillary (tool) 2 between the symmetrically divided pair 32a, 32b divided with a slit 31 from the center line. The capillary 2 can be mounted or removed by temporarily opening the symmetrical pair 32a, 32b through insertion of screws from both sides into a screw hole 20. Since the capillary 2 is held in the symmetrical structure, the high-frequency ultrasonic wave can be transferred without a transfer loss, and the ultra-fine portion can also be connected by using the ultrasonic wave of a small amplitude. COPYRIGHT: (C)2004,JPO
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