| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pad which is useful in in-situ detection of an end point by using an optical method, and also useful in polishing a wafer on which an integrated circuit is mounted. <P>SOLUTION: The pad is useful in polishing the wafer on which the integrated circuit is mounted, and has a first portion and a second portion. The first portion is made of a hard homogeneous resin sheet which has not intrinsic ability of absorption and transportation of slurry particles and allows light beams having a wavelength in the range of 190 to 3,500 nm to pass therethrough. The second portion is made of an air-injected synthetic urethane structure. <P>COPYRIGHT: (C)2010,JPO&INPIT |
