| 发明名称 |
INPUT OUTPUT FOR AN INTEGRATED CIRCUIT |
| 摘要 |
A three-dimensional integrated circuit including a first layer and a second layer electrically coupled to the first layer and disposed in a stacked relationship relative to the first layer. Logic circuitry is embodied in the first layer and input output circuitry of an input output circuit is embodied in the second layer. |
| 申请公布号 |
US2016165730(A1) |
申请公布日期 |
2016.06.09 |
| 申请号 |
US201414561256 |
申请日期 |
2014.12.05 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
FU Chin-Ming |
| 分类号 |
H05K1/18;H05K3/00;H05K3/46;H05K1/02 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A three-dimensional integrated circuit, comprising:
a first layer; a second layer electrically coupled to said first layer and disposed in a stacked relationship relative to said first layer; logic circuitry embodied in said first layer; input output circuitry of an input output circuit adapted to electrically couple said logic circuitry to a component external to said three-dimensional integrated circuit, said input output circuitry embodied in said second layer. |
| 地址 |
Hsin-Chu TW |
