MODULAR PRINTED CIRCUIT BOARD ELECTRICAL INTEGRITY AND USES

摘要

Modular printed circuit board (PCB) structures and methods of producing them are described herein. In some embodiments, a PCB structure may include a first PCB module including first structures on one or more layers of the first PCB module. The PCB structure may further include a second PCB module including second structures on one or more layers of the second PCB module. The PCB structure may additionally include a middle layer between the first PCB module and the second PCB module. The middle layer electrically coupling, without connectors, one or more of the first structures aligned with one or more of the second structures.

主权项

1. A printed circuit board (PCB) structure comprising:
a first PCB module including first structures on one or more layers of the first PCB module; a second PCB module including second structures on one or more layers of the second PCB module; and a middle layer, between the first PCB module and the second PCB module, electrically coupling, without connectors, one or more of the first structures aligned with one or more of the second structures.