发明名称 Analyzing interconnect structures
摘要 In one embodiment, an interconnect structure may be analyzed to determine electromagnetic characteristics of the structure by identifying structure seeds corresponding to the structure; modeling the structure seeds to obtain field patterns; and processing the field patterns to obtain the electromagnetic characteristics.
申请公布号 US2004082230(A1) 申请公布日期 2004.04.29
申请号 US20020281857 申请日期 2002.10.28
申请人 JIAO DAN;MAZUMDER MOHIUDDIN;DAI CHANGHONG 发明人 JIAO DAN;MAZUMDER MOHIUDDIN;DAI CHANGHONG
分类号 G06F17/50;H01R9/22;(IPC1-7):H01R9/22 主分类号 G06F17/50
代理机构 代理人
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