| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
A semiconductor device includes a supporting member, a first semiconductor chip on the supporting member and including an overheating detection circuit, a second semiconductor chip on the first semiconductor chip and including a power semiconductor element, and a sealing member on the supporting member, the first semiconductor chip, and the second semiconductor chip. The overheating detection circuit is provided between the second semiconductor chip and the substrate. |
| 申请公布号 |
US2016172335(A1) |
申请公布日期 |
2016.06.16 |
| 申请号 |
US201514840849 |
申请日期 |
2015.08.31 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
SATO Nobuyuki |
| 分类号 |
H01L25/065;H01L23/367;H01L25/00 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a supporting member; a first semiconductor chip on the supporting member and including an overheating detection circuit; a second semiconductor chip on the first semiconductor chip and including a power semiconductor element; and a sealing member on the supporting member, the first semiconductor chip, and the second semiconductor chip, wherein the overheating detection circuit is between the supporting member and the second semiconductor chip. |
| 地址 |
Tokyo JP |
