HIGH-POWER PACKAGE STRUCTURE FOR REDUCING THICKNESS AND MANUFACTURING COST THEREOF AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A high-power package structure is provided to remove a trim process and a forming process and simplify a fabrication process by mounting flat leads on a bottom face of a heat sink. CONSTITUTION: A plurality of through-holes(111) are formed along each side of a heat sink(110). A plurality of leads(120) are installed on a bottom face of the heat sink corresponding the through-holes. A semiconductor chip(130) is adhered on a center of an upper surface of the heat sink. A wire(133) is used for connecting electrically the semiconductor chip to the leads. The through-holes are filled with a resin(150). An epoxy molding compound(160) is used for sealing up a top part of the heat sink in order to protect the semiconductor chip and the wire from the external environment.