| 摘要 |
In a wafer support structure 10, a ceramic tray plate 12 that is provided with a plurality of wafer placement sections 14, on which wafers W are placed, is disposed on the upper surface of a ceramic base plate 20. A base-side electrode 22 is built into the base plate 20, and a tray-side electrode 18 is built into the tray plate 12. In the wafer support structure 10, the voltage applied to the base-side electrode 22 and the tray-side electrode 18 is adjusted in a state in which a wafer W is placed on a wafer placement section 14. Such a configuration results in the generation of an electrostatic force that pulls the base plate 20 and the tray plate 12 toward each other, and in the generation of an electrostatic force that pulls the tray plate 12 and the wafer W toward each other. |
