| 摘要 |
The present invention relates to a method for bonding a metal having low roughness and a polymer, which comprises the steps of: forming a mask pattern for preventing oxidation on the surface of a Cu layer; forming a CuO layer on the surface exposed by the mask pattern on the surface of the Cu layer; removing the CuO layer formed on the Cu layer; removing the mask pattern formed on the Cu layer; and forming a polymer layer on the Cu layer from which the mask pattern is removed. The present invention also relates to a substrate using the same. According to the present invention, it is possible to improve the adhesion between the metal and polymer by virtue of the surface irregularities having low roughness (rz), to reduce the manufacturing cost by inhibiting the use of an expensive reducing agent, to realize a rapid and simple process by virtue of simple removal of CuO, to improve the productivity and to allow eco-friendly manufacture by minimizing the use of harmful materials. |
