PATTERN FORMING METHOD AND CONTROLLING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a pattern correction method by which a pattern defect can be corrected with high accuracy.SOLUTION: A pattern correction method by an embodiment of the invention includes a step of forming a resist pattern on a first film formed on a substrate, where a resist pattern having a first pattern with a defective pattern is formed in a first region on the first film. Then a protective film is deposited on the first pattern in the first region. A second pattern is transferred to the first film in a second region outside the first region by using the resist pattern and the protective film. Then a third pattern is formed on the first film in the first region.SELECTED DRAWING: Figure 1