PHOTOSENSITIVE RESIN COMPOSITION

摘要

Provided is a photosensitive resin composition which has high sensitivity and enables the achievement of a cured film that exhibits low stress properties, high elongation and excellent adhesion to a metal material, especially excellent adhesion to copper. A photosensitive resin composition which is characterized by containing an alkali-soluble resin that has an organic group derived from an aliphatic diamine.