LIGHT EMITTING DIODE PACKAGE UTILIZING QUANTUM DOTS

摘要

A light emitting diode (LED) package includes a substrate having a first surface and a second surface located opposite at the first surface, an LED chip mounted on the first surface of the substrate, a reflector cup mounted on the first surface of the substrate and surrounding the LED chip therein, and an encapsulation layer located on the reflector cup. The encapsulation layer includes a glue and a plurality of quantum dots mixed in the glue. The quantum dots having a plurality of different diameters and configured to absorb light emitted from the LED chip and thereby become excited to generate light with different wavelengths from the light emitted from the LED chip.

主权项

1. A light emitting diode (LED) package, comprising:
a substrate having a first surface and a second surface located opposite at the first surface; an LED chip mounted on the first surface of the substrate; a reflector cup mounted on the first surface of the substrate and surrounding the LED chip therein; and an encapsulation layer located on the reflector cup, the encapsulation layer comprising a glue and a plurality of quantum dots mixed in the glue, the quantum dots having a plurality of different diameters and configured to absorb light emitted from the LED chip and thereby become excited to generate light with different wavelengths from the light emitted from the LED chip, the light generated by the quantum dots combining with the light from the LED chip to form a white light.