发明名称 |
FIELD EFFECT TRANSISTOR AND METHOD OF MAKING |
摘要 |
A method of fabricating a FET includes forming a gate on the surface of a substrate. A trench contact extends between a first region located proximate the surface of the substrate and a second region located below the first region is formed in the surface. The surface of the substrate is coated with a conductive material, wherein the conductive material at least partially covers the gate and lines the trench contact to electrically connect the first region and the second region. A void remains in the trench contact. A dielectric material is applied to the conductive material, wherein the dielectric material at least partially fills the void in the trench contact. At least a portion of the conductive material is etched from the gate. |
申请公布号 |
US2016315155(A1) |
申请公布日期 |
2016.10.27 |
申请号 |
US201615188188 |
申请日期 |
2016.06.21 |
申请人 |
Texas Instruments Incorporated |
发明人 |
Yang Hong;Lee Zachary K.;Xiong Yufei;Liu Yunlong;Tang Wei |
分类号 |
H01L29/40;H01L29/78 |
主分类号 |
H01L29/40 |
代理机构 |
|
代理人 |
|
主权项 |
1. A field effect transistor (FET) comprising:
a trench contact; a conductive material lining at least a portion of the trench contact; a first region and a second region located proximate the trench contact and electrically coupled by way of the conductive material lining at least a portion of the trench contact; a gate, wherein the conductive material has been etched from at least a portion of the gate; and a dielectric material at least partially filling the trench contact, the dielectric material being resilient to an etching material applied to the conductive material. |
地址 |
Dallas TX US |