PACKAGE ON PACKAGE (POP) DEVICE COMPRISING SOLDER CONNECTIONS BETWEEN INTEGRATED CIRCUIT DEVICE PACKAGES

摘要

Some features pertain to a package on package (PoP) device that includes a first package, a first solder interconnect coupled to the first integrated circuit package, and a second package coupled to the first package through the first solder interconnect. The second package includes a first die, a package interconnect comprising a first pad, where the first solder interconnect is coupled to the first pad of the package interconnect. The second package also includes a redistribution portion coupled to the first die and the package interconnect, an encapsulation layer at least partially encapsulating the first die and the package interconnect. The first pad may include a surface that has low roughness. The encapsulation layer may encapsulate the package interconnect such that the encapsulation layer encapsulates at least a portion of the first solder interconnect.

主权项

1. A package on package (PoP) device comprising:
a first package; a first solder interconnect coupled to the first package; and a second package coupled to the first package through the first solder interconnect, wherein the second package comprises:
a first die;a package interconnect comprising a first pad, wherein the first pad has a first surface that is coupled to the first solder interconnect, and the first surface has a surface roughness Ra value that is about 1 micron (μm) or less;a redistribution portion coupled to the first die and the package interconnect; andan encapsulation layer at least partially encapsulating the first die and the package interconnect.