| 发明名称 |
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A method of manufacturing a semiconductor structure includes providing a first wafer including a surface, removing some portions of the first wafer over the surface to form a plurality of recesses extended over at least a portion of the surface of the first wafer, providing a second wafer, and disposing the second wafer over the surface of the first wafer. |
| 申请公布号 |
US2016315065(A1) |
申请公布日期 |
2016.10.27 |
| 申请号 |
US201615203045 |
申请日期 |
2016.07.06 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
发明人 |
CHEN CHEN-CHUN;CHEN CHIU-JUNG;TSAI FU-TSUN;JANGJIAN SHIU-KO;JENG CHI-CHERNG;CHEN HSIN-CHI |
| 分类号 |
H01L23/00;H01L27/146;H01L21/027;H01L21/306;H01L21/268 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a semiconductor structure, comprising:
providing a first wafer including a surface; removing some portions of the first wafer to form a plurality of recesses extended over at least a portion of the surface of the first wafer; providing a second wafer; and disposing the second wafer over the surface of the first wafer. |
| 地址 |
HSINCHU TW |
