发明名称 LOADLOCK APPARATUS, COOLING PLATE ASSEMBLY, AND ELECTRONIC DEVICE PROCESSING SYSTEMS AND METHODS
摘要 A loadlock apparatus including a lower disc diffuser is provided. The loadlock apparatus includes a loadlock body containing a lower loadlock chamber and an upper load loadlock chamber, a lower cooling plate in the lower loadlock chamber, and an upper cooling plate in the upper loadlock chamber. The lower disc diffuser may be centrally located above the lower cooling plate. An upper disc diffuser may be centrally located above the upper cooling plate. Systems including the loadlock apparatus and methods of operating the loadlock apparatus are provided. A cooling plate assembly that is readily removable for cleaning is also provided, as are numerous other aspects.
申请公布号 US2016314997(A1) 申请公布日期 2016.10.27
申请号 US201514693386 申请日期 2015.04.22
申请人 Applied Materials, Inc. 发明人 Reuter Paul B.;Morey Travis
分类号 H01L21/67;H01L21/687 主分类号 H01L21/67
代理机构 代理人
主权项 1. A loadlock apparatus, comprising: a loadlock body including a lower loadlock chamber and an upper load loadlock chamber; a lower cooling plate provided in the lower loadlock chamber; an upper cooling plate provided in the upper loadlock chamber; a lower disc diffuser centrally located above the lower cooling plate; and an upper disc diffuser centrally located above the upper cooling plate.
地址 Santa Clara CA US