| 摘要 |
A housing used for electronic devices includes a structural frame element formed of a metal matrix composite (MMC) for providing improved stiffness over other materials currency in use. The MMC is a metal matrix (formed of a material such as aluminum), with a reinforcing material (such as a glass fiber or ceramic) dispersed within the metal matrix. The composition of the reinforcing material, as well as the ratio of reinforcing material to metal, define the stiffness (resistance to bending) and/or strength (resistance to breaking) achieved, and various compositions may be used for different housings, depending on the use of the electronic device. The element may be configured as a structural frame member, or may be embedded within another material forming the structural frame element. In another embodiment, the MMC may be used to form various components of the complete housing, including the enclosure itself. |
