| 摘要 |
PURPOSE:To enable to simultaneously assemble and mount many semiconductor devices in a ready manner and to reduce the production cost by constructing to bond the bent part which can be connected face-to-face to a semiconductor pellet to the electrode of a semiconductor pellet at the connecting portions of the external leads to the pellet. CONSTITUTION:A solder plated part 10c is formed with low melting point metal at the end of an external lead 9c for a cathode. Then, a semiconductor diode pellet 11 is placed on the part 10c with a jig. Then, the end of bent to be connected face-to-face to the anode of the pellet 11, and an external lead 9s for an anode which is formed of solder plated part 10a is placed. Then, in order to solder the pellet 11 to the external leads 9c, 9a for the cathode and anode, they are passed through a furnace of 260-350 deg.C of maximum heating temperature of H2 atmosphere. In this manner, many semiconductor diode pellets 11 are completed by one heat treatment in pelletization and bonding. Then, resin molding 12 is performed to protect the pellet. |
