发明名称 |
Optical interconnection of circuit packs |
摘要 |
Disclosed is an apparatus for the optical interconnection of circuit packs and components mounted on circuit packs, and a method of manufacture. Optical fibers are bonded to a flexible substrate. The substrate includes tabs that can be terminated by standard V-groove silicon chip connectors for optical connection to the edges of circuit packs.
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申请公布号 |
US5204925(A) |
申请公布日期 |
1993.04.20 |
申请号 |
US19910757870 |
申请日期 |
1991.09.11 |
申请人 |
AT&T BELL LABORATORIES |
发明人 |
BONANNI, ROCCO;PARZYGNAT, WILLIAM J.;WEISS, ROGER E. |
分类号 |
G02B6/30;G02B6/00;G02B6/28;G02B6/38;G02B6/42;G02B6/43 |
主分类号 |
G02B6/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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