摘要 |
In order to resolve the problems of connecting an integrated circuit (2) with a connector (3) of the chip card type, there is provision for this connector to have connection lands (20-27), the surfaces of which project to constitute two connection alignments (30, 31) perpendicular to standardised alignments (28, 29) of the connector. In this projection, one land (20) projects its connection by passing through the centre of the connector, while the other (22, 24) projects its connection by surrounding, round the outside, the connection projected through the inside. This device is described in an example with eight connection lands per connector, but, needless to say, it can be used with connectors with four, six, eight and even more than eight connection lands. <IMAGE>
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