发明名称 Dry process coating method and apparatus therefor.
摘要 <p>A continuous dry coating method and an apparatus therefor which are capable of removing cut chips and burrs from and smoothing inner walls of small-diameter holes in a substrate material and, then, successively performing a cold coating on these small holes in a short period of time. The continuous dry process coating method comprises the steps of: arranging electrodes on both sides of a substrate material; performing a plasma discharge to surface-treat small holes made in the substrate material; and then performing an electron cyclotron resonance plasma (ECR plasma) coating on the surfaces of these holes. &lt;IMAGE&gt;</p>
申请公布号 EP0574178(A2) 申请公布日期 1993.12.15
申请号 EP19930304290 申请日期 1993.06.03
申请人 OHBA, KAZUO;SHIMA, YOSHINORI;OHBA, AKIRA;SAKAE ELECTRONICS INDUSTRIAL CO., LTD. 发明人 OHBA, KAZUO;SHIMA, YOSHINORI;OHBA, AKIRA
分类号 C23C16/50;C23C16/02;C23C16/04;C23C16/511;C23C16/515;C23C16/54;H01J37/32;H01L21/31;H05K3/40;(IPC1-7):C23C16/54 主分类号 C23C16/50
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