| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing device for the peripheral part of a device wafer, for removing the peripheral part of the upper flat surface as well as the upper edge (a), the lower edge (c) and the outer peripheral surface (b) of the device wafer. <P>SOLUTION: A work W is centered, horizontally placed, and held on a chuck means 21. A driving motor is driven to rotate the work W. A feed motor 624 is driven to slowly reciprocate a polishing member 61 for a flat surface in the direction along the working surface. Simultaneously, a loading means 633 is driven to advance the polishing member 61 for a flat surface from the retreat position toward the work W. When the polishing member 61 for a flat surface is advanced to the working position and comes into contact with the work W, further advance is stopped. While the polishing member 61 for a flat surface is slowly reciprocated, the work W continues rotating so that polishing is making progress by action of supplied slurry and abrasive cloth. <P>COPYRIGHT: (C)2004,JPO |
