| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding material excellent in chemical resistance, a bonded component for endoscope and the endoscope. <P>SOLUTION: The bonding material is constituted of a metal material at least in the vicinity of its surface and used for mutually bonding the components for the endoscope provided at its contact part with a chemical liquid. This bonding material contains 50 wt% or more of gold and also preferably contains at least one kind of metal, other than gold, from silver, nickel, zinc, vanadium, palladium, indium and manganese, and does not contain lead and a halogen element substantially. The bonded component for the endoscope is obtained by bonding pipeline components for the endoscope (endoscope components) mutually with the bonding material and is adapted, for example, to a part of a treatment tool insertion channel as shown in the figure. <P>COPYRIGHT: (C)2004,JPO |
