| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for carrying semiconductor components for resin molding which can surely transfer the semiconductor components to a molding module. SOLUTION: This device is comprised of a pressurizing block 12 which presses a single or a plurality of lead frame(s) 17 orderly provided on an aligning rail 19 from the upper surface side, of a rotary block 16 which can rotate between a chucking position to support near terminal part of the lead frame 17 from the lower surface side and a shunting position which is shunted from the near terminal part of the lead frame 17 and of a rotary cylinder which makes the rotary block 16 to rotate between the chucking position and the shunting position. The rotary block 16 is made to transfer from the shunting position to the chucking position of the lower surface side and is transferred to a molding module by so chucking in a single side holding as to be pressurized between the pressurizing block 12 and the rotary block 16 under the condition of pressing the near terminal part of the single or the plurality of lead frame(s) 17 orderly provided on the aligning rail 19, to the pressurizing block 12 from the upper surface side. |
