Verfahren zum Herstellen von elektronischen Elementen

摘要

The manufacturing method uses a semiconductor wafer with active regions (2) for the electronic elements (1) formed in its front surface, together with spaced separation regions, for dividing the electronic components from one another. A conductive contact layer (7) applied to the front surface is structured to provide contact terminals (9) across at least part of the cross-section of the separation regions, before etching the rear surface of the semiconductor wafer at the separation regions, for separating the contact terminals associated with the different electronic elements.