| 摘要 |
PROBLEM TO BE SOLVED: To enable good soldering by applying flux to a solder bump of an IC board with a plurality of solder bumps, heating and dissolving it, pressing it to a flat surface heating part, cooling it, and restraining the variation of the height of a deformed solder bump within an allowable range. SOLUTION: A reheating part (a) is provided with a heater 4 for heating a solder bump near a melting point of solder, and a redissolving part (b) is provided with a hot plate 5 with a flat plane which is heated near a melting point of solder. Flux is applied to a foot ball-like solder bump 2 of an IC board, which is fed to the redissolving part (b) and pressed to the hot plate 5 with a flat surface which is covered with Teflon, or fluorine compound coating. Thereby, the variation of the height of the solder bump 2 is minimized. An IC board 1 is fed to a cooler (c), and the temperature is lowered. Reliability of connection between the IC board 1 and a printed board can be improved. |
