发明名称 |
Metallisation with segmented, shaped alloy metallisation layer e.g. for power capacitor |
摘要 |
A metallisation for self-healing foil capacitor, in which a dielectric capacitor film (3) provided with a metallic layer (4) is wound in the direction of rotation (Y) of the capacitor film (3) into a capacitor coil, in which the layer (4) is segmented. The layer (4) consists of a structured alloy metallisation applied in a direction (X) transverse to the direction of rotation (Y) of the film (3), and in which the main components of the metallisation are changed depending on the transverse direction (X). The main components of the metallisation are specifically aluminium and zinc, and more specifically silver or magnesium are added to the alloy metallisation.
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申请公布号 |
DE19806586(A1) |
申请公布日期 |
1999.08.26 |
申请号 |
DE19981006586 |
申请日期 |
1998.02.17 |
申请人 |
SIEMENS MATSUSHITA COMPONENTS GMBH & CO. KG |
发明人 |
VETTER, HARALD |
分类号 |
H01G4/008;H01G2/16;H01G4/015;H01G4/18;H01G4/32;H01G4/33;(IPC1-7):H01G4/015 |
主分类号 |
H01G4/008 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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