| 摘要 |
PROBLEM TO BE SOLVED: To use an adhesive film with superior characteristics such as copability, copper foil peeling strength, hardness, electrical erosion resistance, and low thermal expansion as an insulating layer. SOLUTION: Non-fiber inorganic packing agent, whose mean particle diameter is 0.8-5μm, is mixed with varnish using high molecular weight epoxy polymer whose styrene converted weight molecular weight by gel penetration chromatography is 50,000 or higher which is obtained by heating and polymerizing two-functional epoxy resin and a two-functional epoxy phenol group in solvent under the existence of media, multi-functional epoxy resin, hardening agent, and bridging agent as main components. Then, this is applied to one face or both faces of a support, and an epoxy adhesive film obtained by removing the media is used as an insulating layer so that a multilayer printed wiring board is manufactured. |
