| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem that a process from measuring a semiconductor device to storing the semiconductor device includes a large number of transfer times, bringing about quite a few failures such as deforming leads through jamming or contact to the other member, etc., during the time in the prior art. SOLUTION: A carrier tape for the semiconductor device is provided, in which a projecting part shaped like a bridge is set at a central part of each storage part so as to load the semiconductor device with its lead part kept in a float state. Moreover, at least a bottom part member of the storage part opposite to the lead part of he semiconductor device is formed of an anisotropic conductive material. For measuring the semiconductor device, the semiconductor device is pressed from above in a state while the semiconductor device is inserted to the carrier tape, and a probe for measurement is pressed from below to the bottom part member.</p> |
