ULTRASONIC JOINING APPARATUS, AND METHOD FOR PRODUCING ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an ultrasonic joining apparatus capable of sufficiently heating the object to be joined without exerting influence on ultrasonic vibration, and to provide a method for producing an electronic device. SOLUTION: In the ultrasonic joining apparatus, ultrasonic vibration is applied to join a chip 12 and a substrate 9. The apparatus is provided with: a joining stage 8 to be mounted with the substrate 9; an ultrasonic vibrator 2 generating ultrasonic vibration; an ultrasonic horn 1 connected to ultrasonic vibrator 2 and transmitting ultrasonic vibration generated in the ultrasonic vibrator 2 to the chip 12; a heater 3 heating the ultrasonic horn 1; and a moving mechanism realizing a state where the ultrasonic horn 1 and the heater 3 are contacted and a state where the ultrasonic horn 1 and the heater 3 are separated. COPYRIGHT: (C)2005,JPO&NCIPI