| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that is improved in the reliability of hermetically sealing by improving the parallelism of a lid to an insulating substrate and, at the same time, can prevent deposition of contamination to the utmost in a process, even when, for example, an optical semiconductor element is housed and can accurately receive light by preventing the occurrence of flaws and chips in a translucent lid when the lid is the translucent lid. SOLUTION: The semiconductor device 9 is provided with the insulating substrate 1 having a recess 1a for housing a semiconductor element 3 on its top surface and, at the same time, first and second steps 1b and 1c sequentially formed from the inside of the recess 1a to the outside so that the heights of the steps 1b and 1c may become higher sequentially, wiring conductors 2 formed from the internal surface of the recess 1a to at least either the side face or bottom surface of the insulating substrate 1, and the semiconductor element 3 placed on the bottom face of the recess 1a and having electrodes 4 electrically connected to the wiring conductors 2. The semiconductor device 9 is also provided with the lid 5 arranged on the first step 1b. The insulating substrate 1 and lid 5 are bonded to each other with a bonding material 7 packed between the second step 1c and the side face of the lid 5. COPYRIGHT: (C)2006,JPO&NCIPI
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