发明名称 CMP pad conditioner
摘要 A CMP pad conditioner is provided with a grinding part formed by fixing abrasive grains on a metal base by soldering, wherein the grinding part has a flat part near an inner periphery and an inclined part near an outer periphery, wherein abrasive grains having regular shapes are fixed to the flat part, and wherein abrasive grains having acute shapes are fixed to the inclined part.
申请公布号 US2007218821(A1) 申请公布日期 2007.09.20
申请号 US20070714846 申请日期 2007.03.07
申请人 NORITAKE SUPER ABRASIVE CO., LTD. 发明人 NONOSHITA TETSUYA;TOGE NAOKI
分类号 B24B21/18;B24B33/00;B24B53/017;B24B53/02;B24B53/12;B24D3/00 主分类号 B24B21/18
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